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Your search returned 24 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components Packaging And Manufacturing Technology Part A
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Year : 1998 Volume number : 21 Issue: 01 |
The Development Of Component-Level Thermal Compact Models Of A C4/Cbga Interconnect Technology The Motorola Power Pc 603and Power 604 Risc Microprocessors
(Article)
Subject:
Ceramic Ball
,
Computational Fluid Dynamics
,
Thermal Behavior
Author:
John O
Parry
Harvey
Rosten
Gary B.
Kromann
page:
104
-
112
Transient Thermal Management Of Portable Electronics Using Heat Storage And Dynamic Power Dissipation Control
(Article)
Subject:
Heat Storage
,
Thermal Management
,
Power Dissiption
Author:
Lipeng
Cao
Timothy S.
Fisher
page:
113
-
123
On The Positive Temperature Dependence Of The Thermal Conductivity Of A Diamond-Based Heat Sink Paste
(Article)
Subject:
Electronic Packaging
,
Finite Intermediate Frequency
,
Thermal Conductivity
Author:
D. P. H.
Hasselman
Kimberly Y.
Dobaldson
page:
124
-
126
Effects Of Pre-Existing Interfacial Defects On The Stress Profile In Aluminum Interconnection Lines
(Article)
Subject:
Aluminum
,
Finite - Element Analysis
,
Interconnected
Author:
Yu-Lin
Shen
page:
127
-
131
The Evaluation Of Fast-Flow, Cure Underfills For Flip Chip On Organic Substrate
(Article)
Subject:
Flip-Chip
,
Packaging
,
Reliability
,
Underfill Processing
Author:
Kai-Lam
Bill Wun
George
Margaritis
page:
13
-
17
Efficient Design Using Fuzzy Logic Based Regression Models
(Article)
Subject:
Fuzzy Logic
,
Fuzzy System
,
Modeling
,
Packaging
Author:
Brian
Schaible
Yung-Chang
Lee
page:
132
-
141
Multiobjective Optimal Placement Of Convectively Cooled Electronic Components On Printed Wiring Boards
(Article)
Subject:
Electronics
,
Genetic Algorithm
,
Printed Fabric
Author:
Nestor V.
Queipo
page:
142
-
153
Green Design Of Telecom Products The Adsl High Speed Modem As A Case Study
(Article)
Subject:
Asymmetric Digital Subscriber Lines
,
Design For Environment
,
Life Cycle Assessment (Lca)
Author:
Dirk
Ceuterick
Pascal De
Langhe
page:
154
-
167
Analytical Modeling Of Spreading Resistance In Flux Tubes, Half Spaces, And Compound Disks
(Article)
Subject:
Compound Noise
,
Flux Tubes
,
Spreading Rate
Author:
M. Michael
Yovanovich
J. Richard
Culham
Pete
Teertstra
page:
168
-
176
Thermomechanical Models For Leadless Solder Interconnections In Flip Chip Assemblies
(Article)
Subject:
Block
,
Buildings
,
Fc
,
Fiber-Optic
Author:
Wilton W.
King
Daniel L.
Stephenson
page:
177
-
185
Development Of High Conductivity Lead (Pb) Free Conducting Adhesives
(Article)
Subject:
Thermoplastic Polyurethane
,
Electrical Resistance
,
Cu Powder
Author:
Sung K.
Kang
Rajinder S.
Rai
Sampath
Purushothaman
page:
18
-
22
Modular Adapters For Fiber Optics
(Article)
Subject:
Block
,
Fc
,
Fiber-Optic
Author:
Wilton W.
King
Daniel L.
Stephenson
page:
186
-
191
Materia Characterization, Conduction Development, And Cuting Effects On Reliability Of Isotropically Conductive Adhesives
(Article)
Subject:
Vitriflcation
,
Thermo-Mechanical Analysis
,
Temperature Change
Author:
Don
Klosterman
James E.
Morris
page:
23
-
32
A New Leadframe Design Solution For Improved Popcom Cracking Performance
(Article)
Subject:
Adhesion
,
Thermal Resistance
,
Package Parasitic
,
Plasma Catalytic
Author:
Charles
Lee
Heinz
Pape
Teck Chin
Wong
page:
3
-
12
Arc Motion And Pressure Formation In Low Voltage Switchgear
(Article)
Subject:
Switching Activity
,
Pressure Formation
,
Low Voltage
Author:
Manfred
Lindmayer
Joachim
Paulke
page:
33
-
39
Arc Mobility On Bouncing Contacts
(Article)
Subject:
Make Compost
,
Contact Material
,
Arc Mobility
Author:
Engelbert
Hetzmannseder
Verner
Rieder
page:
40
-
45
Measuring Equipment And Measurements Of Adhesive Force Between Gold Electrical Contacts
(Article)
Subject:
Adhesive Force
,
Apparatus
,
Electrical Contact
Author:
Atsuto
Kobayashi
Satoshi
Takano
page:
46
-
53
Modeling Of Energy Transport In Arcing Electrical Contacts To Determine Mass Loss
(Article)
Subject:
Arc Erosions
,
Modeling
,
Silver
Author:
Jonathan
Swingler
John W.
Mcbride
page:
54
-
60
Arc Root Mobility During Contract Opening At High Current
(Article)
Subject:
Circuit Breaker
,
Current Limit
Author:
John W.
Mcbride
P. M.
Weaver
page:
61
-
67
The Spatial Distributions Of Spectral Intensity And Temperature In The4 Cross Section Of An Arc Column Between Separating Pd Contacts
(Article)
Subject:
Arc Temperature
,
Breaking Arc
,
Electrical Contact
Author:
Mitsuru
Takeuchi
Takayoshi
Kubono
page:
68
-
75
Study Of The Local Electrical Properties Of Metal Surfaces Using An Afm With A Conducting Probe
(Article)
Subject:
Atomic Force Microscopy
,
Conducting Polymer
,
Nanoconfinement
Author:
Olivier
Schaneegans
Lionel
Boyer
Frederic
Houze
page:
76
-
81
Arc Lengthening Between Divergent Runners Influence Of Arc Current, Geometry, And Materials Of Runners And Walls
(Article)
Subject:
Arc Length
,
Arc-Wall Interaction
,
Switching Activity
Author:
Ewald
Guster
Werner
Rieder
page:
82
-
95
Simulation Of The Gasdynamic And Electromagnetic Processes In Low Voltage Switching Arcs
(Article)
Subject:
Arc Motion
,
Gasdynamics
,
Switching Loss
Author:
Frank
Karetta
Manfred
Lindmayer
page:
96
-
103
A Thermal Benchmark Chip Design And Applications
(Article)
Subject:
Author:
Vladimir
Szekely
Csaba
Marta
page:
-
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